Our industry experience allows us to provide an intelligent response to all your Electronic Manufacturing service requirements. Whether you require high-level electronic assemblies or Simple Thru hole assembly or Rework boards, you can expect superior quality, prompt customer service and on-time delivery.

we have experienced personnel and Experienced technological equipment to meet all of your electronic assembly requirements, from prototyping to high-volume production. The management team uses a hands-on approach to maintain the best process and delivery.

  • CDM – Customer Designed Manufacturing
    • PROTO BUILDS from 01 nos to any qty
    • Low Volume PCBA/Box Builds
    • Wire Harness Build
    • Rework/Upgrade Facilities
    • Mass Volume Builds
  • ODM
    • Design, Development , Certification & manufacturing of products in consumer
    • IOT & Automotive segment
    • PCB Design /DFM Services

*All above services either in Job Work/ Turnkey or Mix basis

Value Added Services

Products is the manufacturing element of a product development team. If your product is still a proto, We will work together to develop a product that achieves all design criteria and adheres to “Design for Manufacture Principles”. Properly designed products will create efficient manufacturing with effective results and lasting reliability.

“Design for Manufacture” is imperative to achieving target pricing in a globally completive marketplace. Our team can provide specialised, professional people that can do it right the first time We also provide Management Service of Source identification and Alternate development for your Product sourcing manufacturing solutions.

Prototypes

Our team specialized in PCB assembly prototypes production (proto and pilot batch support) offering very short lead time and high-quality products. Our objective is to save you time and give you more efficiency in your R&D cycle PCBA prototyping phase. Semcom keeps working to continuously improve its services and offering you a quality that meets your highest expectations.

Capacities
Assembly typesTHT (through hole)
SMT (surface mount)
Conformal coating
Mixed assembly
2-sided assembly
Press-Fit Connector mounting
Quantity per orderProto and Pilot batch support
Component typesPassive components up to 0201
BGA (until pitch 0.35mm), QFN, POP, uBGA and conductorless chips
Connectors
Components’ PackagingReel
Cut Tape
Board dimensions and shapeSmallest size: 10 x 10 mm
Largest size: 450 x 450 mm
Round, rectangular, complex or irregular shape
With holes and cut-outs
MaterialRigid FR4 / SMI/ etc.
Flexi-rigid boards (on request after study)
Assembly proceedingLead or lead-free (RoHS) process
Required filesGerber RS-274X
BOM (List of Materials)
Pick-N-Place / XY file
PDF format layout drawing
Quality controlX-Ray inspections for BGA and QFN
AOI (Automated Optical Inspection)
Visual inspection at each assembly step
Impedance testing (on request)
Metallographic section (on request)
Production report
Order lead timeDelivery from 5 business days (for a 2 layer PCBA)
SolderingSMT Steam phase furnace soldering
THT manual soldering
Infrared soldering station on sensitive components
CertificationISO9001:2015
Files formatEagle, Altium, Gerber 274X